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19-4419; Rev 0; 1/09
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
General Description
The MAX19995A dual-channel downconverter is designed to provide 8.7dB of conversion gain, +24.8dBm input IP3, +13.5dBm 1dB input compression point, and a noise figure of 9.2dB for 1700MHz to 2200MHz diversity receiver applications. With an optimized LO frequency range of 1750MHz to 2700MHz, this mixer is ideal for high-side LO injection architectures. Low-side LO injection is supported by the MAX19995, which is pin-pin and functionally compatible with the MAX19995A. In addition to offering excellent linearity and noise performance, the MAX19995A also yields a high level of component integration. This device includes two doublebalanced passive mixer cores, two LO buffers, a dualinput LO selectable switch, and a pair of differential IF output amplifiers. Integrated on-chip baluns allow for single-ended RF and LO inputs. The MAX19995A requires a nominal LO drive of 0dBm and a typical supply current of 350mA at VCC = 5.0V, or 242mA at VCC = 3.3V. The MAX19995/MAX19995A are pin compatible with the MAX19985/MAX19985A series of 700MHz to 1000MHz mixers and pin similar to the MAX19997A/MAX19999 series of 1800MHz to 4000MHz mixers, making this entire family of downconverters ideal for applications where a common PCB layout is used across multiple frequency bands. The MAX19995A is available in a 6mm x 6mm, 36-pin thin QFN package with an exposed pad. Electrical performance is guaranteed over the extended temperature range (TC = -40C to +85C).
Features
1700MHz to 2200MHz RF Frequency Range 1750MHz to 2700MHz LO Frequency Range 50MHz to 500MHz IF Frequency Range 8.7dB Typical Conversion Gain 9.2dB Typical Noise Figure +24.8dBm Typical Input IP3 +13.5dBm Typical Input 1dB Compression Point 64dBc Typical 2LO-2RF Spurious Rejection at PRF = -10dBm Dual Channels Ideal for Diversity Receiver Applications 48dB Typical Channel-to-Channel Isolation Low -3dBm to +3dBm LO Drive Integrated LO Buffer Internal RF and LO Baluns for Single-Ended Inputs Built-In SPDT LO Switch with 48dB LO-to-LO Isolation and 50ns Switching Time Pin Compatible with the MAX19985/MAX19985A/ MAX19995 Series of 700MHz to 2200MHz Mixers Pin Similar to the MAX19997A/MAX19999 Series of 1800MHz to 4000MHz Mixers Single 5.0V or 3.3V Supply External Current-Setting Resistors Provide Option for Operating Device in Reduced-Power/ReducedPerformance Mode
MAX19995A
Applications
UMTS/WCDMA Base Stations LTE/WiMAXTM Base Stations TD-SCDMA Base Stations DCS1800/PCS1900 and GSM/EDGE Base Stations cdma2000(R) Base Stations Fixed Broadband Wireless Access Wireless Local Loop Private Mobile Radios Military Systems
Ordering Information
PART MAX19995AETX+ TEMP RANGE -40C to +85C PIN-PACKAGE 36 Thin QFN-EP*
MAX19995AETX+T -40C to +85C 36 Thin QFN-EP* +Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
T = Tape and reel.
WiMAX is a trademark of WiMAX Forum. cdma2000 is a registered trademark of Telecommunications Industry Association. Pin Configuration/Functional Diagram appears at end of data sheet.
1
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +5.5V LO1, LO2 to GND ..................................................-0.3V to +0.3V LOSEL to GND ...........................................-0.3V to (VCC + 0.3V) RFMAIN, RFDIV, and LO_ Input Power ..........................+15dBm RFMAIN, RFDIV Current (RF is DC shorted to GND through a balun)..............................................................50mA Continuous Power Dissipation (Note 1) ...............................8.7W JA (Notes 2, 3)..............................................................+38C/W JC (Notes 1, 3)...............................................................7.4C/W Operating Case Temperature Range (Note 4) ....-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C
Note 1: Based on junction temperature TJ = TC + (JC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150C. Note 2: Junction temperature TJ = TA + (JA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150C. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = 4.75V to 5.25V, no input AC signals. TC = -40C to +85C, R1 = R4 = 681, R2 = R5 = 1.5k. Typical values are at VCC = 5.0V, TC = +25C, unless otherwise noted. All parameters are production tested.)
PARAMETER Supply Voltage Supply Current LOSEL Input High Voltage LOSEL Input Low Voltage LOSEL Input Current SYMBOL VCC ICC VIH VIL IIH and IIL -10 Total supply current, VCC = 5.0V 2 0.8 +10 CONDITIONS MIN 4.75 TYP 5 350 MAX 5.25 410 UNITS V mA V V A
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = 3.0V to 3.6V, no input AC signals. TC = -40C to +85C, R1 = R4 = 909, R2 = R5 = 1k. Typical values are at VCC = 3.3V, TC = +25C, unless otherwise noted. Parameters are guaranteed by design and not production tested.)
PARAMETER Supply Voltage Supply Current LOSEL Input High Voltage LOSEL Input Low Voltage SYMBOL VCC ICC VIH VIL Total supply current CONDITIONS MIN 3.0 TYP 3.3 242 2 0.8 MAX 3.6 300 UNITS V mA V V
2
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Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER RF Frequency LO Frequency SYMBOL fRF fLO (Note 5) (Note 5) Using Mini-Circuits TC4-1W-17 4:1 transformer as defined in the Typical Application Circuit, IF matching components affect the IF frequency range (Note 5) IF Frequency fIF Using alternative Mini-Circuits TC4-1W-7A 4:1 transformer as defined in the Typical Application Circuit, IF matching components affect the IF frequency range (Note 5) CONDITIONS MIN 1700 1750 TYP MAX 2200 2700 UNITS MHz MHz
MAX19995A
100
500 MHz
50
250
LO Drive Level
PLO
-3
+3
dBm
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, R1 = R4 = 681, R2 = R5 = 1.5k, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2000MHz, fLO = 2050MHz to 2350MHz, fIF = 350MHz, fRF < fLO, TC = -40C to +85C. Typical values are at VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 6)
PARAMETER Conversion Gain SYMBOL GC CONDITIONS TC = +25C (Note 7) TC = +25C, fRF = 1850MHz (Note 8) Flatness over any one of three frequency bands: fRF = 1710MHz to 1785MHz fRF = 1850MHz to 1910MHz fRF = 1920MHz to 1980MHz Gain Variation Over Temperature Input Compression Point Input Third-Order Intercept Point Input Third-Order Intercept Point Variation Over Temperature TCCG IP1dB IIP3 fRF = 1700MHz to 2000MHz, fLO = 2050MHz to 2350MHz, TC = -40C to +85C fRF = 1850MHz (Notes 7, 9) fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone, TC = +25C fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone, TC = -40C to +85C Single sideband, no blockers present Noise Figure (Note 10) NFSSB fRF = 1850MHz, fLO = 2200MHz, TC = +25C, PLO = 0dBm, single sideband, no blockers present Single sideband, no blockers present, TC = -40C to +85C 9.5 21.5 22 MIN 6.5 7.1 7.7 TYP 8.7 8.7 8.7 +0.07 dB -0.03 -0.13 -0.011 13.5 24.8 24.8 0.006 9.2 9.2 11.1 9.8 dB dBm dB/C dBm MAX 10.4 9.9 9.7 dB UNITS
Conversion Gain Flatness
GC
TCIIP3
dBm/C
Noise Figure Temperature Coefficient
TCNF
0.016
dB/C
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3
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(Typical Application Circuit, R1 = R4 = 681, R2 = R5 = 1.5k, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2000MHz, fLO = 2050MHz to 2350MHz, fIF = 350MHz, fRF < fLO, TC = -40C to +85C. Typical values are at VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 6)
PARAMETER SYMBOL CONDITIONS PBLOCKER = +8dBm, fRF = 1850MHz, fLO = 2200MHz, fBLOCKER = 1725MHz, PLO = 0dBm, VCC = 5.0V, TC = +25C (Notes 10, 11) fRF = 1850MHz, fLO = 2200MHz, fSPUR = 2025MHz 2LO-2RF Spur Rejection (Note 10) 2x2 fRF = 1850MHz, fLO = 2200MHz, fSPUR = 2025MHz, PLO = 0dBm, VCC = 5.0V, TC = +25C fRF = 1850MHz, fLO = 2200MHz, fSPUR = 2083.33MHz 3LO-3RF Spur Rejection (Note 10) 3x3 fRF = 1850MHz, fLO = 2200MHz, fSPUR = 2083.33MHz, PLO = 0dBm, VCC = 5.0V, TC = +25C PRF = -10dBm PRF = -5dBm PRF = -10dBm PRF = -5dBm PRF = -10dBm PRF = -5dBm PRF = -10dBm PRF = -5dBm 54 49 57 MIN TYP MAX UNITS
Noise Figure with Blocker
NFB
19.7
23.4
dB
64 59 64 dBc
52 70 60 71
59 80 70 80 dBc
61
70 21 20 dB 22 200 dB
RF Input Return Loss
LO and IF terminated into matched impedance, LO on LO port selected, RF and IF terminated into matched impedance
LO Input Return Loss
LO port unselected, RF and IF terminated into matched impedance ZIF Nominal differential impedance of the IF outputs RF terminated into 50, LO driven by 50 source, IF transformed to 50 using external components shown in the Typical Application Circuit (Note 8) (Note 8) (Note 8) (Note 8) 31
IF Output Impedance
IF Output Return Loss
11.5
dB
RF-to-IF Isolation LO Leakage at RF Port 2LO Leakage at RF Port LO Leakage at IF Port
35 -35 -17.5 -32 -25 -14 -22
dB dBm dBm dBm
4
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Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(Typical Application Circuit, R1 = R4 = 681, R2 = R5 = 1.5k, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2000MHz, fLO = 2050MHz to 2350MHz, fIF = 350MHz, fRF < fLO, TC = -40C to +85C. Typical values are at VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 6)
PARAMETER SYMBOL CONDITIONS RFMAIN converted power measured at IFDIV relative to IFMAIN, all unused ports terminated to 50 RFDIV converted power measured at IFMAIN relative to IFDIV, all unused ports terminated to 50 PLO1 = +3dBm, PLO2 = +3dBm, fLO1 = 2200MHz, fLO2 = 2201MHz (Note 7) 50% of LOSEL to IF settled within 2 degrees MIN 40 TYP 48 dB 40 48 MAX UNITS
MAX19995A
Channel Isolation (Note 7)
LO-to-LO Isolation LO Switching Time
40
48 50
dB ns
3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, R1 = R4 = 909, R2 = R5 = 1k. Typical values are at VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.) (Note 6)
PARAMETER Conversion Gain SYMBOL GC (Note 8) Flatness over any one of three frequency bands: fRF = 1710MHz to 1785MHz fRF = 1850MHz to 1910MHz fRF = 1920MHz to 1980MHz Gain Variation Over Temperature Input Compression Point Input Third-Order Intercept Point Input Third-Order Intercept Point Variation Over Temperature Noise Figure Noise Figure Temperature Coefficient 2LO-2RF Spur Rejection 3LO-3RF Spur Rejection RF Input Return Loss TCCG IP1dB IIP3 TCIIP3 NFSSB TCNF 2x2 3x3 TC = -40C to +85C (Note 9) fRF1 - fRF2 = 1MHz fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone, TC = -40C to +85C Single sideband, no blockers present Single sideband, no blockers present, TC = -40C to +85C PRF = -10dBm PRF = -5dBm PRF = -10dBm PRF = -5dBm LO and IF terminated into matched impedance, LO on CONDITIONS MIN TYP 8.4 +0.07 dB -0.03 -0.13 -0.013 10.2 22.5 0.0017 9 0.016 65 60 77 67 25 dB/C dBm dBm dBm/C dB dB/C dBc dBc dB MAX UNITS dB
Conversion Gain Flatness
GC
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5
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(Typical Application Circuit, R1 = R4 = 909, R2 = R5 = 1k. Typical values are at VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.) (Note 6)
PARAMETER SYMBOL CONDITIONS LO port selected, RF and IF terminated into matched impedance LO port unselected, RF and IF terminated into matched impedance RF terminated into 50, LO driven by 50 source, IF transformed to 50 using external components shown in the Typical Application Circuit MIN TYP 22 dB 16 MAX UNITS
LO Input Return Loss
IF Output Return Loss
11.5
dB
RF-to-IF Isolation LO Leakage at RF Port 2LO Leakage at RF Port LO Leakage at IF Port RFMAIN converted power measured at IFDIV relative to IFMAIN, all unused ports terminated to 50 RFDIV converted power measured at IFMAIN relative to IFDIV, all unused ports terminated to 50 PLO1 = +3dBm, PLO2 = +3dBm, fLO1 = 2200MHz, fLO2 = 2201MHz 50% of LOSEL to IF settled within 2 degrees
36 -40 -23 -37 48
dB dBm dBm dBm
Channel Isolation
dB 48
LO-to-LO Isolation LO Switching Time
47 50
dB ns
Note 5:
Not production tested. Operation outside this range is possible, but with degraded performance of some parameters. See the Typical Operating Characteristics. Note 6: All limits reflect losses of external components, including a 0.9dB loss at fIF = 350MHz due to the 4:1 transformer. Output measurements were taken at IF outputs of the Typical Application Circuit. Note 7: 100% production tested. Note 8: 100% production tested for functionality. Note 9: Maximum reliable continuous input power applied to the RF or IF port of this device is +12dBm from a 50 source. Note 10: Not production tested. Note 11: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Application Note 2021: Specifications and Measurement of Local Oscillator Noise in Integrated Circuit Base Station Mixers.
6
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Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics
(Typical Application Circuit, R1 = R4 = 681, R2 = R5 = 1.5k, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
MAX19995A
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc01
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc02
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc03
10 TC = -30C CONVERSION GAIN (dB) 9
10
10
CONVERSION GAIN (dB)
8 TC = +85C TC = +25C
8 PLO = -3dBm, 0dBm, +3dBm 7
CONVERSION GAIN (dB)
9
9
8 VCC = 4.75V, 5.0V, 5.25V 7
7
6 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
6 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
6 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
MAX19995A toc04
INPUT IP3 vs. RF FREQUENCY
MAX19995A toc05
INPUT IP3 vs. RF FREQUENCY
PRF = -5dBm/TONE VCC = 5.25V 25 INPUT IP3 (dBm)
MAX19995A toc06 MAX19995A toc09
26 TC = +85C 25 INPUT IP3 (dBm) PRF = -5dBm/TONE
26 PLO = +3dBm 25 INPUT IP3 (dBm) PRF = -5dBm/TONE
26
24 TC = +25C TC = -30C 23
24 PLO = 0dBm 23 PLO = -3dBm
24 VCC = 5.0V 23 VCC = 4.75V
22 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
22 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
22 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
NOISE FIGURE vs. RF FREQUENCY
MAX19995A toc07
NOISE FIGURE vs. RF FREQUENCY
MAX19995A toc08
NOISE FIGURE vs. RF FREQUENCY
12 11 NOISE FIGURE (dB) 10 9 8 VCC = 4.75V, 5.0V, 5.25V 7 6
12 TC = +85C 11 NOISE FIGURE (dB) 10 9 8 TC = +25C 7 6 1700 1800 1900 2000 2100 TC = -30C
12 11 NOISE FIGURE (dB) 10 9 8 PLO = -3dBm, 0dBm, +3dBm 7 6
2200
1700
1800
1900
2000
2100
2200
1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
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7
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
Typical Operating Characteristics (continued)
(Typical Application Circuit, R1 = R4 = 681, R2 = R5 = 1.5k, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX19995A toc10
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX19995A toc11
2LO-2RF RESPONSE vs. RF FREQUENCY
PRF = -5dBm 2LO-2RF RESPONSE (dBc) 80
MAX19995A toc12 MAX19995A toc18 MAX19995A toc15
90 PRF = -5dBm 2LO-2RF RESPONSE (dBc) 80 TC = +85C 70
90 PRF = -5dBm 2LO-2RF RESPONSE (dBc) 80 PLO = +3dBm 70
90
70
60
60
60
50 TC = -30C 40 1700 1800 1900
TC = +25C
50 PLO = -3dBm 40 2200 1700 1800 PLO = 0dBm
50 VCC = 4.75V, 5.0V, 5.25V 40 1900 2000 2100 2200 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz) RF FREQUENCY (MHz)
2000
2100
RF FREQUENCY (MHz)
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX19995A toc13
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX19995A toc14
3LO-3RF RESPONSE vs. RF FREQUENCY
85 PRF = -5dBm VCC = 5.0V 3LO-3RF RESPONSE (dBc) VCC = 4.75V 75
85 PRF = -5dBm TC = +85C 3LO-3RF RESPONSE (dBc) 75
85 PRF = -5dBm 3LO-3RF RESPONSE (dBc)
75
65 TC = +25C 55 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz) TC = -30C
65 PLO = -3dBm, 0dBm, +3dBm
65 VCC = 5.25V
55 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
55 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
INPUT P1dB vs. RF FREQUENCY
MAX19995A toc16
INPUT P1dB vs. RF FREQUENCY
MAX19995A toc17
INPUT P1dB vs. RF FREQUENCY
16 VCC = 5.0V VCC = 5.25V
16 TC = +85C
16
15 INPUT P1dB (dBm)
15 INPUT P1dB (dBm)
15 INPUT P1dB (dBm)
14
14
14
13 TC = -30C
TC = +25C
13 PLO = -3dBm, 0dBm, +3dBm
13
12
12
12
VCC = 4.75V
11 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
11 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
11 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
8
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Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(Typical Application Circuit, R1 = R4 = 681, R2 = R5 = 1.5k, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
MAX19995A
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc19
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc20
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc21
55
55
55
CHANNEL ISOLATION (dB)
CHANNEL ISOLATION (dB)
50
50
CHANNEL ISOLATION (dB)
50
45 TC = -30C, +25C, +85C
45 PLO = -3dBm, 0dBm, +3dBm
45 VCC = 4.75V, 5.0V, 5.25V
40 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
40 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
40 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX19995A toc22
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX19995A toc23
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX19995A toc24
-20
-20
-20
LO LEAKAGE AT IF PORT (dBm)
LO LEAKAGE AT IF PORT (dBm)
-25
TC = +85C
-25
PLO = -3dBm, 0dBm, +3dBm
LO LEAKAGE AT IF PORT (dBm)
-25 VCC = 5.25V -30
VCC = 5.0V
-30
-30
-35 TC = +25C -40 2050 2150 2250 2350 2450 2550 LO FREQUENCY (MHz) TC = -30C
-35
-35 VCC = 4.75V
-40 2050 2150 2250 2350 2450 2550 LO FREQUENCY (MHz)
-40 2050 2150 2250 2350 2450 2550 LO FREQUENCY (MHz)
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19995A toc25
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19995A toc26
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19995A toc27
45
45
45
RF-TO-IF ISOLATION (dB)
RF-TO-IF ISOLATION (dB)
PLO = -3dBm, 0dBm, +3dBm 40
RF-TO-IF ISOLATION (dB)
VCC = 4.75V, 5.0V, 5.25V 40
40
TC = +85C
35 TC = +25C TC = -30C 30 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
35
35
30 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
30 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
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9
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
Typical Operating Characteristics (continued)
(Typical Application Circuit, R1 = R4 = 681, R2 = R5 = 1.5k, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX19995A toc28
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX19995A toc29
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX19995A toc30
-20 LO LEAKAGE AT RF PORT (dBm)
-20 LO LEAKAGE AT RF PORT (dBm) PLO = -3dBm -30 PLO = 0dBm
-20 LO LEAKAGE AT RF PORT (dBm)
-30
TC = +25C
TC = -30C
-30
-40
-40 PLO = +3dBm
-40 VCC = 4.75V, 5.0V, 5.25V -50
TC = +85C -50 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz) -50 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz) 1750
1950
2150
2350
2550
2750
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX19995A toc31
2LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX19995A toc32
2LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX19995A toc33
-10 2LO LEAKAGE AT RF PORT (dBm) TC = -30C -20
-10 2LO LEAKAGE AT RF PORT (dBm)
-10 2LO LEAKAGE AT RF PORT (dBm)
-20
PLO = +3dBm
-20
-30
TC = +25C
-30 PLO = 0dBm -40 PLO = -3dBm -50
-30
-40 TC = +85C -50 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
-40
VCC = 4.75V, 5.0V, 5.25V
-50 1750 1950 2150 2350 2550 2750 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz) LO FREQUENCY (MHz)
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19995A toc34
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19995A toc35
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19995A toc36
60 TC = -30C LO SWITCH ISOLATION (dB) TC = +25C 50
60
60
LO SWITCH ISOLATION (dB)
LO SWITCH ISOLATION (dB)
50
50
40 TC = +85C
40 PLO = -3dBm, 0dBm, +3dBm
40
VCC = 4.75V, 5.0V, 5.25V
30 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
30 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
30 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
10
______________________________________________________________________________________
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(Typical Application Circuit, R1 = R4 = 681, R2 = R5 = 1.5k, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
RF PORT RETURN LOSS vs. RF FREQUENCY
MAX19995A toc37
MAX19995A
IF PORT RETURN LOSS vs. IF FREQUENCY
MAX19995A toc38
LO SELECTED RETURN LOSS vs. LO FREQUENCY
MAX19995A toc39
0 fIF = 350MHz 5 RF PORT RETURN LOSS (dB) 10 15 20 25
0 L = L1, L2, L4, L5 IF PORT RETURN LOSS (dB) L = 120nH L = 330nH 10 fLO = 2300MHz VCC = 4.75V, 5.0V, 5.25V
0 LO SELECTED RETURN LOSS (dB) 5 PLO = -3dBm, 0dBm, +3dBm 10 15 20 25 30
5
PLO = -3dBm, 0dBm, +3dBm
15 L = 470nH
30 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
20 50 140 230 320 410 500 IF FREQUENCY (MHz)
1750
1950
2150
2350
2550
2750
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS vs. LO FREQUENCY
MAX19995A toc40
SUPPLY CURRENT vs. TEMPERATURE (TC)
VCC = 5.25V 380 SUPPLY CURRENT (mA)
MAX19995A toc41
CONVERSION GAIN vs. RF FREQUENCY (VARIOUS VALUES OF L3 AND L6)
MAX19995A toc42
0 LO UNSELECTED RETURN LOSS (dB) 5 10 15 20 PLO = -3dBm, 0dBm, +3dBm 25 30 1750 1950 2150 2350 2550
400
11
10 CONVERSION GAIN (dB)
360
9
340 VCC = 5.0V VCC = 4.75V 300
8 0, 3.6nH, 6.8nH, 10nH 7
320
6 -35 -15 5 25 45 65 85 1700 1800 1900 2000 2100 2200 TEMPERATURE (C) RF FREQUENCY (MHz)
2750
LO FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY (VARIOUS VALUES OF L3 AND L6)
MAX19995A toc43
2LO-2RF RESPONSE vs. RF FREQUENCY (VARIOUS VALUES OF L3 AND L6)
MAX19995A toc44
3LO-3RF RESPONSE vs. RF FREQUENCY (VARIOUS VALUES OF L3 AND L6)
PRF = -5dBm 3LO-3RF RESPONSE (dBc)
MAX19995A toc45
26 PRF = -5dBm/TONE 25 INPUT IP3 (dBm)
90 PRF = -5dBm 2LO-2RF RESPONSE (dBc) 80 0
85
75
70
24 0, 3.6nH, 6.8nH, 10nH 23
60
65 0, 3.6nH, 6.8nH, 10nH
50 6.8nH, 10nH 22 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz) 40 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz) 3.6nH 55 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
______________________________________________________________________________________
11
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
Typical Operating Characteristics (continued)
(Typical Application Circuit, R1 = R4 = 681, R2 = R5 = 1.5k, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
CHANNEL ISOLATION vs. RF FREQUENCY (VARIOUS VALUES OF L3 AND L6)
MAX19995A toc46
LO LEAKAGE AT IF PORT vs. LO FREQUENCY (VARIOUS VALUES OF L3 AND L6)
0 10nH LO LEAKAGE AT IF PORT (dBm) -30
MAX19995A toc47
RF-TO-IF ISOLATION vs. RF FREQUENCY (VARIOUS VALUES OF L3 AND L6)
6.8nH RF-TO-IF ISOLATION (dB) 40 10nH
MAX19995A toc48
55 10nH CHANNEL ISOLATION (dB) 6.8nH 50
-20
50
-40
6.8nH
30 3.6nH 20 0 10
45 0 3.6nH
-50 3.6nH -60
40 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
2050
2150
2250
2350
2450
2550
1700
1800
1900
2000
2100
2200
LO FREQUENCY (MHz)
RF FREQUENCY (MHz)
12
______________________________________________________________________________________
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics
(Typical Application Circuit, R1 = R4 = 909, R2 = R5 = 1k, VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
MAX19995A
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc49
CONVERSION GAIN vs. RF FREQUENCY
VCC = 3.3V CONVERSION GAIN (dB) 9
MAX19995A toc50
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc51
10 TC = -30C CONVERSION GAIN (dB) 9 VCC = 3.3V
10
10
CONVERSION GAIN (dB)
9
VCC = 3.6V
8
8 PLO = -3dBm, 0dBm, +3dBm 7
8 VCC = 3.0V 7 VCC = 3.3V
7
TC = +25C TC = +85C
6 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
6 1700
1800
1900
2000
2100
2200
6 1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
MAX19995A toc52
INPUT IP3 vs. RF FREQUENCY
MAX19995A toc53
INPUT IP3 vs. RF FREQUENCY
VCC = 3.6V 23 INPUT IP3 (dBm) 22 21 20 19 18 VCC = 3.0V VCC = 3.3V PRF = -5dBm/TONE
MAX19995A toc54
24 23 INPUT IP3 (dBm) 22 21 20 TC = -30C 19 18 1700 1800 TC = +85C
TC = +25C PRF = -5dBm/TONE VCC = 3.3V
24 PLO = +3dBm 23 INPUT IP3 (dBm) 22 21 20 PLO = -3dBm 19 18
PRF = -5dBm/TONE VCC = 3.3V
24
PLO = 0dBm
1900
2000
2100
2200
1700
1800
1900
2000
2100
2200
1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
NOISE FIGURE vs. RF FREQUENCY
MAX19995A toc55
NOISE FIGURE vs. RF FREQUENCY
VCC = 3.3V 11 NOISE FIGURE (dB) 10 9 8 7 6
MAX19995A toc56
NOISE FIGURE vs. RF FREQUENCY
MAX19995A toc57
12 VCC = 3.3V 11 NOISE FIGURE (dB) 10 9 8 7 6 1700 1800 1900 2000 2100 TC = -30C TC = +85C
12
12 11 NOISE FIGURE (dB) 10 9 8 7 6 VCC = 3.0V, 3.3V, 3.6V
TC = +25C
PLO = -3dBm, 0dBm, +3dBm
2200
1700
1800
1900
2000
2100
2200
1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
______________________________________________________________________________________
13
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
Typical Operating Characteristics (continued)
(Typical Application Circuit, R1 = R4 = 909, R2 = R5 = 1k, VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX19995A toc58
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX19995A toc59
2LO-2RF RESPONSE vs. RF FREQUENCY
PRF = -5dBm
MAX19995A toc60
80 TC = +85C 70
PRF = -5dBm VCC = 3.3V
80 VCC = 3.3V 2LO-2RF RESPONSE (dBc) 70 PRF = -5dBm
80
2LO-2RF RESPONSE (dBc)
2LO-2RF RESPONSE (dBc)
70
60
60
60
50 TC = -30C 40 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz) TC = +25C
50 PLO = -3dBm, 0dBm, +3dBm 40 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
50 VCC = 3.0V, 3.3V, 3.6V 40 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX19995A toc61
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX19995A toc62
3LO-3RF RESPONSE vs. RF FREQUENCY
VCC = 3.6V 3LO-3RF RESPONSE (dBc) PRF = -5dBm
MAX19995A toc63
80 TC = +85C 3LO-3RF RESPONSE (dBc) 70 PRF = -5dBm VCC = 3.3V
80 PLO = +3dBm 3LO-3RF RESPONSE (dBc) 70 PRF = -5dBm VCC = 3.3V
80
70
60 TC = +25C TC = -30C
60
PLO = 0dBm PLO = -3dBm
60 VCC = 3.0V VCC = 3.3V
50 1700
1800
1900
2000
2100
2200
50 1700
1800
1900
2000
2100
2200
50 1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT P1dB vs. RF FREQUENCY
MAX19995A toc64
INPUT P1dB vs. RF FREQUENCY
MAX19995A toc65
INPUT P1dB vs. RF FREQUENCY
VCC = 3.6V 11 INPUT P1dB (dBm)
MAX19995A toc66
12 TC = +85C 11 INPUT P1dB (dBm) VCC = 3.3V
12 VCC = 3.3V 11 INPUT P1dB (dBm)
12
10 TC = +25C TC = -30C 9
10 PLO = -3dBm PLO = 0dBm, +3dBm 9
10 VCC = 3.3V 9 VCC = 3.0V
8 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
8 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
8 1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
14
______________________________________________________________________________________
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(Typical Application Circuit, R1 = R4 = 909, R2 = R5 = 1k, VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
MAX19995A
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc67
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc68
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc69
55 VCC = 3.3V CHANNEL ISOLATION (dB)
55 VCC = 3.3V CHANNEL ISOLATION (dB)
55
50
50
CHANNEL ISOLATION (dB)
50
45
TC = -30C, +25C, +85C
45
PLO = -3dBm, 0dBm, +3dBm
45
VCC = 3.0V, 3.3V, 3.6V
40 1700
1800
1900
2000
2100
2200
40 1700
1800
1900
2000
2100
2200
40 1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX19995A toc70
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
VCC = 3.3V LO LEAKAGE AT IF PORT (dBm) -35
MAX19995A toc71
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
VCC = 3.6V LO LEAKAGE AT IF PORT (dBm) -35
MAX19995A toc72
-30 VCC = 3.3V LO LEAKAGE AT IF PORT (dBm) TC = +85C -35
-30
-30
-40
TC = -30C
-40
-40 VCC = 3.0V -45 VCC = 3.3V
-45
TC = +25C
-45
PLO = -3dBm, 0dBm, +3dBm
-50 2050
2150
2250
2350
2450
2550
-50 2050
-50 2150 2250 2350 2450 2550 2050 2150 2250 2350 2450 2550 LO FREQUENCY (MHz) LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19995A toc73
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19995A toc74
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19995A toc75
45 VCC = 3.3V RF-TO-IF ISOLATION (dB)
45 VCC = 3.3V RF-TO-IF ISOLATION (dB) PLO = -3dBm, 0dBm, +3dBm 40
45
40
TC = +85C
RF-TO-IF ISOLATION (dB)
VCC = 3.0V, 3.3V, 3.6V 40
35 TC = -30C 30 1700 1800 1900
TC = +25C
35
35
30 2000 2100 2200 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz) RF FREQUENCY (MHz)
30 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
______________________________________________________________________________________
15
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
Typical Operating Characteristics
(Typical Application Circuit, R1 = R4 = 909, R2 = R5 = 1k, VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX19995A toc76
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX19995A toc77
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
VCC = 3.6V LO LEAKAGE AT RF PORT (dBm)
MAX19995A toc78
-30 TC = -30C LO LEAKAGE AT RF PORT (dBm) VCC = 3.3V
-30 VCC = 3.3V LO LEAKAGE AT RF PORT (dBm)
-30
-40 TC = +25C -50 TC = +85C
-40
-40
PLO = -3dBm, 0dBm, +3dBm -50
-50
VCC = 3.0V
VCC = 3.3V
-60 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
-60 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
-60 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX19995A toc79
2LO LEAKAGE AT RF PORT vs. LO FREQUENCY
VCC = 3.3V 2LO LEAKAGE AT RF PORT (dBm) -20 PLO = +3dBm
MAX19995A toc80
2LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX19995A toc81
-10 VCC = 3.3V 2LO LEAKAGE AT RF PORT (dBm) -20 TC = -30C
-10
-10 2LO LEAKAGE AT RF PORT (dBm)
-20
VCC = 3.6V
-30 TC = +85C -40 TC = +25C
-30 PLO = -3dBm -40 PLO = 0dBm
-30
VCC = 3.3V
-40
VCC = 3.0V
-50 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
-50 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
-50 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19995A toc82
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19995A toc83
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19995A toc84
60 VCC = 3.3V TC = -30C LO SWITCH ISOLATION (dB) 50
60 VCC = 3.3V LO SWITCH ISOLATION (dB)
60
50
LO SWITCH ISOLATION (dB)
50
40
TC = +85C
40
TC = +25C
PLO = -3dBm, 0dBm, +3dBm
40
VCC = 3.0V, 3.3V, 3.6V
30 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
30 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
30 1750 1950 2150 2350 2550 2750 LO FREQUENCY (MHz)
16
______________________________________________________________________________________
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(Typical Application Circuit, R1 = R4 = 909, R2 = R5 = 1k, VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC = +25C, unless otherwise noted.)
RF PORT RETURN LOSS vs. RF FREQUENCY
MAX19995A toc85
MAX19995A
IF PORT RETURN LOSS vs. IF FREQUENCY
MAX19995A toc86
LO SELECTED RETURN LOSS vs. LO FREQUENCY
VCC = 3.3V LO SELECTED RETURN LOSS (dB) 5 10 15 20 25 30 PLO = -3dBm, 0dBm, +3dBm
MAX19995A toc87
0 5 10 15 20 25 PLO = -3dBm, 0dBm, +3dBm fIF = 350MHz VCC = 3.3V
0 L = L1, L2, L4, L5 IF PORT RETURN LOSS (dB) fLO = 2300MHz VCC = 3.3V
0
RF PORT RETURN LOSS (dB)
5
L = 120nH
10
15 L = 330nH L = 470nH 20
30 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz)
50
140
230
320
410
500
1750
1950
2150
2350
2550
2750
IF FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS vs. LO FREQUENCY
MAX19995A toc88
SUPPLY CURRENT vs. TEMPERATURE (TC)
VCC = 3.6V 260 SUPPLY CURRENT (mA)
MAX19995A toc89
0 VCC = 3.3V LO UNSELECTED RETURN LOSS (dB) 5 10 15 20 PLO = -3dBm, 0dBm, +3dBm 25 30 1750 1950 2150 2350 2550
280
240
220 VCC = 3.3V 200 VCC = 3.0V
180 2750 -35 -15 5 25 45 65 85 LO FREQUENCY (MHz) TEMPERATURE (C)
______________________________________________________________________________________
17
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
Pin Description
PIN 1 2 3, 5, 7, 12, 20, 22, 24, 25, 26, 34 4, 6, 10, 16, 21, 30, 36 8 9 11 NAME RFMAIN TAPMAIN FUNCTION Main Channel RF input. Internally matched to 50. Requires an input DC-blocking capacitor. Main Channel Balun Center Tap. Bypass to GND with 39pF and 0.033F capacitors as close as possible to the pin with the smaller value capacitor closer to the part. Ground Power Supply. Bypass to GND with capacitors as shown in the Typical Application Circuit as close as possible to the pin. Diversity Channel Balun Center Tap. Bypass to GND with 39pF and 0.033F capacitors as close as possible to the pin with the smaller value capacitor closer to the part. Diversity Channel RF input. Internally matched to 50. Requires an input DC-blocking capacitor. IF Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for the diversity IF amplifier (see the Typical Operating Characteristics for typical performance vs. resistor value). Diversity Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC (see the Typical Application Circuit). Diversity External Inductor Connection. Connect this pin to ground. For improved RF-to-IF and LO-toIF isolation, connect a low-ESR 10nH inductor from this pin to ground (see the Typical Operating Characteristics for typical performance vs. inductor value). LO Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for the diversity LO amplifier (see the Typical Operating Characteristics for typical performance vs. resistor value). No Connection. Not internally connected. Local Oscillator 1 Input. This input is internally matched to 50. Requires an input DC-blocking capacitor. Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2. Local Oscillator 2 Input. This input is internally matched to 50. Requires an input DC-blocking capacitor. LO Main Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for the main LO amplifier (see the Typical Operating Characteristics for typical performance vs. resistor value). Main External Inductor Connection. Connect this pin to ground. For improved RF-to-IF and LO-to-IF isolation, connect a low-ESR 10nH inductor from this pin to ground (see the Typical Operating Characteristics for typical performance vs. inductor value). Main Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC (see the Typical Application Circuit). IF Main Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for the main IF amplifier (see the Typical Operating Characteristics for typical performance vs. resistor value). Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the noted RF performance.
GND
VCC TAPDIV RFDIV IFD_SET
13, 14
IFD+, IFD-
15
IND_EXTD
17 18, 28 19 23 27 29
LO_ADJ_D N.C. LO1 LOSEL LO2 LO_ADJ_M
31
IND_EXTM
32, 33 35
IFM-, IFM+ IFM_SET
--
EP
18
______________________________________________________________________________________
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Detailed Description
The MAX19995A is a dual-channel downconverter designed to provide up to 8.7dB of conversion gain, +24.8dBm input IP3, +13.5dBm 1dB input compression point, and a noise figure as low as 9.2dB. In addition to its high-linearity performance, the MAX19995A achieves a high level of component integration. The device integrates two double-balanced mixers for two-channel downconversion. Both the main and diversity channels include a balun and matching circuitry to allow 50 single-ended interfaces to the RF ports and the two LO ports. An integrated singlepole/double-throw (SPDT) switch provides 50ns switching time between the two LO inputs, with 48dB of LO-to-LO isolation and -35dBm of LO leakage at the RF port. Furthermore, the integrated LO buffers provide a high drive level to each mixer core, reducing the LO drive required at the MAX19995A's inputs to a range of -3dBm to +3dBm. The IF ports for both channels incorporate differential outputs for downconversion, which are ideal for providing enhanced 2LO-2RF performance. Specifications are guaranteed over broad frequency ranges to allow for use in UMTS/WCDMA, LTE/WiMAX, DCS1800/PCS1900 GSM/EDGE, TD-SCDMA, and cdma2000 base stations. The MAX19995A is specified to operate over an RF input range of 1700MHz to 2200MHz, an LO range of 1750MHz to 2700MHz, and an IF range of 50MHz to 500MHz. The external IF components set the lower frequency range (see the Typical Operating Characteristics for details). Operation beyond these ranges is possible; see the Typical Operating Characteristics for additional information. Although this device is optimized for high-side LO injection applications, it can operate in low-side LO injection modes as well. However, performance degrades as fLO continues to decrease. For increased low-side LO performance, refer to the MAX19995 data sheet.
LO Inputs, Buffer, and Balun
The MAX19995A is optimized for a 1750MHz to 2700MHz LO frequency range. As an added feature, the MAX19995A includes an internal LO SPDT switch for use in frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically 50ns, which is more than adequate for typical GSM applications. If frequency hopping is not employed, simply set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL), where logic-high selects LO1 and logic-low selects LO2. LO1 and LO2 inputs are internally matched to 50, requiring only 39pF DC-blocking capacitors. If LOSEL is connected directly to a logic source, then voltage MUST be applied to VCC before digital logic is applied to LOSEL to avoid damaging the part. Alternatively, a 1k resistor can be placed in series at the LOSEL to limit the input current in applications where LOSEL is applied before VCC. The main and diversity channels incorporate a twostage LO buffer that allows for a wide-input power range for the LO drive. The on-chip low-loss baluns, along with LO buffers, drive the double-balanced mixers. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip.
MAX19995A
High-Linearity Mixer
The core of the MAX19995A dual-channel downconverter consists of two double-balanced, high-performance passive mixers. Exceptional linearity is provided by the large LO swing from the on-chip LO buffers. When combined with the integrated IF amplifiers, the cascaded IIP3, 2LO-2RF rejection, and noise-figure performance are typically +24.8dBm, 64dBc, and 9.2dB, respectively.
Differential IF
The MAX19995A has an IF frequency range of 50MHz to 500MHz, where the low-end frequency depends on the frequency response of the external IF components. Note that these differential ports are ideal for providing enhanced IIP2 performance. Single-ended IF applications require a 4:1 (impedance ratio) balun to transform the 200 differential IF impedance to a 50 singleended system. After the balun, the return loss is typically 11.5dB. The user can use a differential IF amplifier on the mixer IF ports, but a DC block is required on both IFD+/IFD- and IFM+/IFM- ports to keep external DC from entering the IF ports of the mixer.
RF Port and Balun
The RF input ports of both the main and diversity channels are internally matched to 50, requiring no external matching components. A DC-blocking capacitor is required as the input is internally DC shorted to ground through the on-chip balun. The RF port input return loss is typically better than 16.5dB over the RF frequency range of 1700MHz to 2200MHz.
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19
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50. No matching components are required. The RF port input return loss is typically better than 16.5dB over the RF frequency range of 1700MHz to 2200MHz and return loss at the LO ports is typically better than 15dB over the entire LO range. RF and LO inputs require only DC-blocking capacitors for interfacing. The IF output impedance is 200 (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance to a 50 single-ended output (see the Typical Application Circuit).
Layout Considerations
A properly designed PCB is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. The load impedance presented to the mixer must be so that any capacitance from both IF- and IF+ to ground does not exceed several picofarads. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PCB exposed pad MUST be connected to the ground plane of the PCB. It is suggested that multiple vias be used to connect this pad to the lower-level ground planes. This method provides a good RF/thermal-conduction path for the device. Solder the exposed pad on the bottom of the device package to the PCB. The MAX19995A evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com.
Reduced-Power Mode
Each channel of the MAX19995A has two pins (LO_ADJ_, IF_SET) that allow external resistors to set the internal bias currents. Nominal values for these resistors are given in Table 1. Larger value resistors can be used to reduce power dissipation at the expense of some performance loss. If 1% resistors are not readily available, substitute with 5% resistors. Significant reductions in power consumption can also be realized by operating the mixer with an optional supply voltage of 3.3V. Doing so reduces the overall power consumption by up to 54%. See the 3.3V Supply AC Electrical Characteristics table and the relevant 3.3V curves in the Typical Operating Characteristics section.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin and TAPMAIN/TAPDIV with the capacitors shown in the Typical Application Circuit (see Table 1 for component values). Place the TAPMAIN/TAPDIV bypass capacitors to ground within 100 mils of the pin.
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX19995A's 36-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PCB on which the MAX19995A is mounted be designed to conduct heat from the EP. In addition, provide the EP with a lowinductance path to electrical ground. The EP MUST be soldered to a ground plane on the PCB, either directly or through an array of plated via holes.
IND_EXT_ Inductors
For applications requiring optimum RF-to-IF and LO-toIF isolation, connect low-ESR inductors from IND_EXT_ (pins 15 and 31) to ground. When improved isolation is not required, connect IND_EXT_ to ground using 0 resistance. See the Typical Operating Characteristics to evaluate the isolation vs. inductor value tradeoff.
20
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Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
Table 1. Component Values
DESIGNATION C1, C2, C7, C8, C14, C16 C3, C6 C4, C5 C9, C13, C15, C17, C18 C10, C11, C12, C19, C20, C21 L1, L2, L4, L5 L3, L6 QTY 6 2 2 5 6 4 2 DESCRIPTION 39pF microwave capacitors (0402) 0.033F microwave capacitors (0603) Not used 0.01F microwave capacitors (0402) 150pF microwave capacitors (0603) 120nH wire-wound high-Q inductors (0805) 10nH wire-wound high-Q inductors (0603). Smaller values can be used at the expense of some performance loss (see the Typical Operating Characteristics). 681 1% resistors (0402). Used for VCC = 5.0V applications. Larger values can be used to reduce power at the expense of some performance loss (see the Typical Operating Characteristics). 909 1% resistors (0402). Used for VCC = 3.3V applications. 1.5k 1% resistors (0402). Used for VCC = 5.0V applications. Larger values can be used to reduce power at the expense of some performance loss (see the Typical Operating Characteristics). 1k 1% resistors (0402). Used for VCC = 3.3V applications. R3, R6 T1, T2 U1 2 2 1 0 resistors (1206) 4:1 transformers (200:50) TC4-1W-17 MAX19995A IC (36 TQFN-EP) Digi-Key Corp. Mini-Circuits Maxim Integrated Products, Inc. COMPONENT SUPPLIER Murata Electronics North America, Inc. Murata Electronics North America, Inc. -- Murata Electronics North America, Inc. Murata Electronics North America, Inc. Coilcraft, Inc. Coilcraft, Inc.
R1, R4
2
Digi-Key Corp.
R2, R5
2
Digi-Key Corp.
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Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX19995A
Typical Application Circuit
C19
T1 VCC L1 R3 C21 IF MAIN OUTPUT
L2 4:1 R1 VCC C20 L3 R2 VCC
IFM_SET
GND
IFM-
LO_ADJ_M
IND_EXTM
C18
C17
IFM+
C1 RF MAIN INPUT
+
RFMAIN TAPMAIN 1 2 3 4 5 6 7 8 9
36
35
34
33
32
31
30
29
28 N.C.
VCC
VCC
C16 27 LO2 GND GND GND LOSEL GND VCC VCC GND LO1 C14 C15 LO SELECT LO2
MAX19995A
26 25 24 23 22 21
C3 VCC
C2
GND VCC
C4 VCC C5 C6
GND VCC GND C7 TAPDIV RFDIV C8
EXPOSED PAD
20 19
RF DIV INPUT
LO1
15
11
12
10
13
14
IND_EXTD
IFD_SET
16
17 LO_ADJ_D
GND
IFD+
VCC C9
R4
N.C.
IFD-
VCC
VCC
18
R5
VCC
C13 L6 C11
T2 L5 VCC R6 C12
L4 4:1
IF DIV OUTPUT
C10
22
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Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch
Pin Configuration/Functional Block Diagram
29 LO_ADJ_M
MAX19995A
TOP VIEW
31 IND_EXTM 35 IFM_SET 33 IFM+ 32 IFM34 GND 36 VCC 30 VCC
+
RFMAIN TAPMAIN GND VCC GND VCC GND TAPDIV RFDIV 1 2 3 4 5 6 7 8 9 EXPOSED PAD 27 LO2 GND GND GND LOSEL GND VCC GND LO1
MAX19995A
28 N.C.
26 25 24 23 22 21 20 19
10
11
12
13
14
15
16
17 LO_ADJ_D
IND_EXTD
IFD_SET
IFD+
IFD-
GND
THIN QFN (EXPOSED PAD) 6mm x 6mm
EXPOSED PAD ON THE BOTTOM OF THE PACKAGE
Chip Information
PROCESS: SiGe BiCMOS
N.C.
VCC
VCC
18
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. PACKAGE TYPE 36 Thin QFN-EP PACKAGE CODE T3666+2 DOCUMENT NO. 21-0141
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 23
(c) 2009 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.

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